MIJING Z20 PHONE 13 Series Middle Layer Board Reball Station

Mijing Z20 4 in 1 BGA Reballing Fixture for 13/13 Mini/13 Pro/13Pro Max 1. Install the 13 main board on the platform 2. Cover the 13 BGA reballing stencil on mainboard 3. Evenly spread tin on the cover of the reballing stencil 4. Remove the reballing stencil cover 5. Take out the motherboard and cooperate with the hot air gun to solidify the tin point.