鲁斑 LB TOOL GJD-IC1 Chip Tin Plating ARC Cushion Pad

Features: -High-Temperature Resistant: Made to withstand soldering and hot air temperatures without melting or deforming -Soft & Flexible: Durable silicone twists, folds, and stretches for easy storage and use -Sloped Arc Design: Beveled surface keeps chips and stencils perfectly aligned during reballing -Non-Deformable Material: Bounces back to its original shape, even after repeated use -Universal Compatibility: Applicable to the majority of CPU/IC chips, motherboards, and phone repair stencils Use for: -Phone Repair Technicians: Essential for BGA/CPU reballing and chip-level soldering -PCB & BGA Repair Pros: Perfect for holding chips steady during hot air rework -Repair Shop Owners: Durable, reusable mat that saves time and prevents chip damage -DIY Electronics Hobbyists: Makes home reballing projects cleaner and more precise